realme X2 Pro is the company first flagship smartphone and featuring 2019’s most powerful mobile processor, 7nm process Qualcomm Snapdragon 855 Plus AI SoC (System-on-Chip).
The main difference between the Snapdragon 855 and 855 Plus are the higher clock “Prime Core” that goes up to 2.98Ghz from 2.84Ghz and boosted Adreno 640 GPU at 672Mhz from 585MHz.
The company picked the fines mobile processor to make the device as powerful possible integrated with high-speed LPDDR4X RAM and UFS 3.0 storage technology. With the configuration, the realme X2 Pro will able to deliver astonishing performance regardless of gaming or productivity.
Of course, when come to high-performance heats would be the biggest enemy. realme got you covered with a premium Vapor Chambers system that heats dissipation area up to 1,373mm² of the phone body. It even has superconducting carbon fibres, a multi-layer graphite sheet that 100% fully covered core heating source. This would greatly improve cooling performance and guaranteeing peak processor performance at all time.
Disclaimer: Advertorial from realme Malaysia