Qualcomm is having its annual Tech Summit in Maui, Hawaii with the announcement of three new mobile processor chipset that’s integrated with the 5G modem.
First is the Qualcomm Snapdragon 865 flagship processor which is the successor of the Snapdragon 855 and 855 Plus chipset. It gets an improved Qualcomm X55 5G modem that supports multi-gigabit speeds of up to 7.5 Gbps and supports all key regions and frequency bands from 5G mmWave and sub-6 TDD and FDD, to SA and NSA modes.
Performance-wise, the new chip boast of improved A.I. and 25% increase in graphics performance. The chip is built on 7nm process based on Qualcomm Kyro 585 CPU with clock speed up to 2.85Ghz and Qualcomm Adreno 650 GPU. The SoC now supports LPDDR5 RAM up to 2,750MHz. The Snapdragon 865 also supports Bluetooth 5.1, Wi-Fi 6 (802.11ax), Qualcomm aptX Adaptive and high refresh rate up to 144 Hz on QHD+ resolution.
The new ISP on this new chip is now able to handle up to 200-megapixels resolutions camera sensor, record video up to 8K at 30fps or 4K at 120fps and supports QHD+
As for the Qualcomm Snapdragon 765 and 765G are the mid-range 5G enabled SoC. It’s based on the 7nm process Kyro 475 with clock speed up to 2.3GHz. The main difference between the 765 and 765G are the binned GPU on the 765G similar to the 730 and 730G. It uses Qualcomm X52 Modem that supports download speed up to 3.7Gbps and global 5G multi-SIM.
The Snapdragon 765/765G supports Wi-Fi 6 (802.11ax), Bluetooth 5.0, Qualcomm aptX Adaptive. It will be supporting HDR10 4K recording and up-to 192-megapixels resolutions image.
Qualcomm also announced its next-generation ultrasonic fingerprint sensor technology which they called 3D Sonic Max that offers larger fingerprint scanner area and support authentication of two fingers, simultaneously.
Source: Qualcomm (1), (2), (3)
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