Pan Jiutang, an analyst has confirmed the existence of the MediaTek Helio X30. The Helio X30 is expected to be built by TSMC by using 10nm FinFET process and introduced a new ARM Artemis cores.
It will be in Deca-core (10-cores) SoC setup with breakdown of dual-core 2.8GHz Artemis ARM core, Quad-core 2.2GHz ARM Cortex-A53 and Quad-core 2.0GHz ARM Cortex-A35. It will be mated with PowerVR 7XT GPU. The new Helio X30 will continue to adopt tri-cluster CPU architecture.
The new Helio X30 will support dual camera set up, a 26 Megapixel camera, VR connection, LTE Cat. 13 connectivity and 8GB of RAM.
Jiutang also shared a comparison AnTuTu benchmark score chart of few SoC that includes; MediaTek Helio X10, MediaTek Helio X120, Qualcomm Snapdragon 810, Qualcomm Snapdragon 820, Samsung Exynos 7420, Huawei HiSilicon Kirin 950 and also MediaTek Helio X30. On the test, the Helio X30 topping the list ousted the powerful chip Qualcomm Snapdragon 820.
There are no words when the Helio X30 will be mass use on smartphone but definitely won’t be this year.
Via: PhoneArena, Source: PanJiutang (Weibo)
Leave a Comment